commit | 9654e034b6eda21e64aebb1802f6a13661924681 | [log] [tgz] |
---|---|---|
author | Souvik Roy <souvikroyofficial10@gmail.com> | Wed Sep 17 17:18:42 2025 +0000 |
committer | SunnySrivastava <sunnsr25@in.ibm.com> | Fri Sep 19 04:31:50 2025 +0000 |
tree | 2ccdc9d9e49579d4f205c4e1de9295db38c1d832 | |
parent | 0d63123e34fb97ed35332a0cd874079bdc121844 [diff] |
Check for empty interface property pair This commit adds check for empty interface property pair before processing it. In some patch sets CI is complaining for the check, hence it has been added. Test: ``` - Do vpd-tool writeKeyword operation on /system/chassis/motherboard's VINI record PN keyword - Observe the write operation is successful and /system/chassis's Decorator.Asset PartNumber property is also updated with the same value ``` Change-Id: Ib3b8ca67684746dc8728c1cda89cfee72a62b191 Signed-off-by: Souvik Roy <souvikroyofficial10@gmail.com>
This repository hosts code for OpenPower and IBM IPZ format VPD parsers. Both OpenPower VPD and IPZ VPD formats are structured binaries that consist of records and keywords. A record is a collection of multiple keywords. More information about the format can be found at a broken link.
The repository consists of two distinct applications, which are:
This is a build-time YAML driven application that parses the OpenPower VPD format and uses the YAML configuration (see extra-properties-example.yaml and writefru.yaml) to determine:
The application instance must be passed in the file path to the VPD (this can, for example, be a sysfs path exposed by the EEPROM device driver) and also the D-Bus object path(s) that EEPROM data needs to be published under.
This parser is can be built by passing in the --enable-ibm-parser
configure option. This parser differs from the OpenPower VPD parser in the following ways:
#
and are > 255 bytes in length).Making the application runtime JSON driven allows us to support multiple systems (with different FRU configurations) to be supported in a single code image as well as making the application more flexible for future improvements.